MEMS sensors for flow measurement in harsh environments
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Introduction
1
Literature review on flow sensing for harsh environments
1.1
Flow equations and turbulence scales
1.2
Flow measurement techniques
1.2.1
Historical overview
1.2.2
Hot wires
1.2.3
Wall shear stress sensors
1.2.4
Summary table of existing flow sensors
1.3
Adapting MEMS thermal anemometers to harsh environments
1.3.1
SiC as a material for harsh environments
1.3.2
Developments of SiC-based MEMS
1.3.3
SiC-based thermal anemometers
1.4
Objectives of this work
2
Technological developments of 3C–SiC thermal devices
2.1
Resistors from 3C–SiC films epitaxially grown on silicon
2.1.1
Development of an etching process for 3C–SiC layers
2.1.2
SiC
2.2
Electric insulation of 3C–SiC resistors
2.2.1
Producing
2.2.2
The challenge to build calorimetric sensors
2.3
Etching process of 3C–SiC thin films
2.3.1
Reactive Ion Etching
2.3.2
Bosch process
2.4
Fabrication of SiC calorimeters
2.4.1
Design
2.4.2
SoI insulation
2.4.3
Highly resistive 3C–SiC buried layer insulation
2.4.4
Transfer to borosilicate glass
2.5
Characterizations
2.5.1
Characterization setup
2.5.2
TCR measurement
2.5.3
Resistance-Power characteristic
2.6
Conditioning of hot-wire sensors
2.6.1
Development of a CTA suited for SiC hot wires
2.6.2
Frequency response assessment
3
Sensor testings in real flows
3.1
Wind tunnel testings
3.2
Wind tunnel facility
3.3
Flush-mounting of sensors on the wind tunnel wall
3.4
Wall shear stress calibration
3.4.1
The Coles-Fernholz method
3.4.2
Calorimetric response to wall shear stress
3.5
Square-wave tests
3.5.1
Theory
3.6
Overheat effect
3.7
Dynamic response
Conclusion
References
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1 Literature review on flow sensing for harsh environments
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1.4 Objectives of this work
#
1.4
Objectives of this work
The state of the art presented above
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Technological developments of 3C–SiC thermal devices